Title :
System integration for miniature node of wireless sensor network (WSN)
Author :
Gaowei Xu ; Enliang Song ; Xiao Chen ; Shuangfu Wang ; Chunsheng Zhu ; Jiaotuo Ye ; Le Luo
Author_Institution :
State Key Lab. of Transducer Technol., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
Abstract :
A type of 3D-SiP (System in Package) package for wireless sensor network (WSN) node was designed and developed based on an embedded FR-4 substrate using 3D technology (including, embedded way and stacked way) and SiP technology. The 3D-SiP package including sensor (sound or vibration) module, baseband ASIC chips, digital signal processor (DSP) chips, other chips and various passive components, was studied. FCOB (flip-chip on board), COB (chip on board), BGA technologies, wire bonding flip-chip bonding and surface mount (SMT) etc. interconnection technologies were combined together. Several kinds of solder materials with different melting points were used for initial and final vertical interconnections for the sake of compatibility of all levels interconnections by reflowing. High density WSN node with ASIC chip embedded in and sensor module stacked on high density multi-layer FR-4 substrate was designed and manufactured. The thermal management was conducted and the thermal related reliability of 3D-SiP were simulated and evaluated respectively.
Keywords :
application specific integrated circuits; ball grid arrays; flip-chip devices; integrated circuit interconnections; lead bonding; semiconductor device reliability; surface mount technology; system-in-package; thermal management (packaging); three-dimensional integrated circuits; wireless sensor networks; 3D technology; 3D-SiP package; 3D-SiP technology; BGA technology; DSP chip; FCOB; SMT; baseband ASIC chip; digital signal processor chip; embedded FR-4 substrate; embedded technology; flip-chip bonding; flip-chip on board; high density WSN node; high density multilayer FR-4 substrate; interconnection technology; melting point; miniature node; passive component; sensor module; solder material; sound module; stacked technology; surface mount; system in package; system integration; thermal management; thermal related reliability; vertical interconnection; vibration module; wire bonding; wireless sensor network; Application specific integrated circuits; Electronic packaging thermal management; Packaging; Reliability; Substrates; Thermal conductivity; Wireless sensor networks; Miniature node of WSN; SiP (system in package); combination of multiple interconnections; embedded substrate; stack-up; three-dimensional (3D) package;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474577
