Research on electroplating process of SiC/Al electronic packaging composites

In this study, in order to improve the surface properties and weldability of the high volume fraction SiC/Al composites, a novel method of nickel gold plating technology was investigated. Bright, dense, uniform, continuous nickel-gold plating layers formed on the surface of the composite, micrograph and composition of the layers were observed and analysed respectively. The experiment results showed that, the interface adhesion between the coatings and composite substrate is improved by the special process, and no impurities were found both in the Ni layers and Au layers. In addition, quality, thickness, conductivity, and air tightness of the coating layers were detected in the testing laboratory. The results showed that above performances of the layers met the requirement of the electronic packaging shell, and the plating layers offered good weldability.