Title :
Silver-based thermal interface materials with low thermal resistance
Author :
Hui Yu ; Rui Zhang ; Liangliang Li ; Xiaofei Mao ; Hongda Du
Author_Institution :
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
Abstract :
We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.
Keywords :
nanoparticles; power electronics; thermal resistance; AgNP; SP; TIM; low thermal resistance; power electronics applications; silver nanoparticles; silver paste; silver-based thermal interface materials; thermal cycling; Electronic packaging thermal management; Materials; Nanoparticles; Silver; Thermal conductivity; Thermal resistance; silver nanoparticle; silver paste; thermal resistance;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474646
