Title :
TSV modeling and thermal analysis based on 3D package
Author :
Wenchao Tian ; Wenlong Wang ; Hongming Wang
Author_Institution :
Sch. of Electro-Mech. Eng., Xidian Univ., Xi´´an, China
Abstract :
TSV heat models with different pitches, straight through holes and circular truncated cones are established. Simulation results are obtained, and compared with wire bonding results. The conclusion that the heat dissipation effect of TSV technology is better than that of wire bonding technology is obtained. Heat dissipation effect has nothing to do with TSV shape under the same TSV pitches.
Keywords :
cooling; integrated circuit modelling; integrated circuit packaging; thermal analysis; three-dimensional integrated circuits; 3D packaging; TSV heat modeling; circular truncated cone; heat dissipation effect; straight through hole; thermal analysis; wire bonding technology; Abstracts; Through-silicon vias; 3D lamination; TSV; electronic packaging;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474677
