DocumentCode :
3504645
Title :
Thermo-mechanical characteristics of indium micro-joint under various low-temperature excursions
Author :
Cheng, Xiaoyin ; Liu, Cong ; Silberschmidt, Vadim V.
Author_Institution :
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough, UK
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
766
Lastpage :
770
Abstract :
Properties of an indium joint used as interconnection in pixelated detector systems play a key role in determining their functionality since each indium joint represents a pixel, which defines a resolution limit of the sensor. Additionally, such detectors are required to operate at cryogenic temperatures. Thus, the thermal conditions that indium joints in service life can be harsh, for example, changing from room temperature to liquid-nitrogen temperature. In this paper, thermo-mechanical characteristics of indium joints under various low-temperature excursions were investigated numerically. This approach provides a useful tool for the better understanding of a thermo-mechanical response of such system to various in-service conditions as well as their reliable performance.
Keywords :
cryogenic electronics; indium alloys; interconnections; low-temperature techniques; temperature sensors; In; cryogenic temperatures; indium microjoint; liquid-nitrogen temperature; low-temperature excursions; pixelated detector system interconnection; sensor; service life; temperature 293 K to 298 K; thermomechanical response characteristics; Abstracts; Indium; Joints; Strain; Temperature sensors; Thermal expansion; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474726
Filename :
6474726
Link To Document :
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