DocumentCode :
3505365
Title :
Connected component labeling on a one dimensional DSP array
Author :
Ercan, M. Fikret ; Fung, Yu-Fai
Author_Institution :
Dept. of Electr. Eng., Singapore Polytech., Singapore
Volume :
2
fYear :
1999
fDate :
36495
Firstpage :
1299
Abstract :
This paper presents a parallel implementation of connected component labeling algorithms for gray and binary images on a one-dimensional DSP array. The system is a distributed memory MIMD and all the algorithms are developed considering this platform. Performance results of several parallel connected component labeling methods are evaluated. The multi-DSP system has demonstrated a viable performance
Keywords :
digital signal processing chips; distributed memory systems; image processing; parallel algorithms; parallel architectures; 1D DSP array; TI320C40 processor; Texas Instruments; binary images; connected component labeling; connected component labeling algorithms; distributed memory MIMD; divide and conquer; gray images; multi-DSP system; parallel algorithms; parallel implementation; performance results; Application software; Computer vision; Digital signal processing; Global communication; Image segmentation; Labeling; Memory architecture; Merging; Parallel algorithms; Partitioning algorithms;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 99. Proceedings of the IEEE Region 10 Conference
Conference_Location :
Cheju Island
Print_ISBN :
0-7803-5739-6
Type :
conf
DOI :
10.1109/TENCON.1999.818667
Filename :
818667
Link To Document :
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