The challenge of grinding technology for TSV and BSI device

The demand from digital mobile industry is pushing the development of smaller, more compact and more effective electronic device likes SiP, RFID and etc in the past few years. For a higher performance and energy saving solution, the development of TSV (Through Silicon Via) package has been sped up for the past few years. In China, the development of TSV and BSI (Backside illumination) technology for high pixel camera module used in the smart phone is progressing rapidly since the past one year. For TSV and BSI device, the requirement of grinding process is different from the normal grinding system used in the backend assembly process. In this paper, the author would like to discuss about the requirement needed in this technology.