DocumentCode :
3505771
Title :
Effects of sulfide on silver-plated lead frame on wire bonding quality
Author :
Zhang, H.M. ; Zong, Fenghua ; Hu, Minglie ; Ye, D.H. ; He, Q.C.
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1030
Lastpage :
1033
Abstract :
Copper lead frame with silver plated layer was widely used in the assembly industry and H2S (hydrogen sulfide) in air sulfurized the silver plated layer as well as formed Ag2S (silver sulfide) film which changed the surface topography of lead fingers and degraded the wire bonding ability. The control of storage environment and exposing time as well as the application of pre-wire-bonding plasma could bring benefits to the actual production.
Keywords :
hydrogen compounds; lead bonding; silver compounds; surface topography; Ag2S; H2S; assembly industry; lead fingers; prewire-bonding plasma; silver-plated lead frame; storage environment control; surface topography; wire bonding quality; Abstracts; Films; Gold; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474783
Filename :
6474783
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3505771
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