Title :
Packaging of filter-integrated hybrid transceiver for subscriber access network
Author :
Moon, Sungwook ; Han, Sub ; Choi, Jung-Ho ; Shin, Sang-Gil ; Ryu, Gihan ; Park, Sung-Woong ; Song, Sun-Ho ; Margalit, Moti ; Avni, Eitan ; Rogovsky, Gideon
Author_Institution :
Telecommun. Lab., LS Cable Ltd., Kyungki-do, South Korea
Abstract :
We demonstrated a low-cost packaging of bidirectional transceiver using filter-integrated PLC platform for subscriber access networks. An adiabatic WDM filter was optimized and designed by BPM simulation. We fabricated a bidirectional transceiver using modified multi-chip bonding scheme for flip-chip bonding of active components and V-shaped groove for optical interconnection. As a result, the optical performance of fabricated transceiver satisfied the criteria required by Ethernet passive optical network.
Keywords :
bonding processes; flip-chip devices; integrated optics; optical communication equipment; optical fabrication; optical fibre LAN; optical fibre subscriber loops; optical filters; optical interconnections; packaging; transceivers; wavelength division multiplexing; BPM simulation; Ethernet passive optical network; PLC platform; V-shaped groove; WDM filter; bidirectional transceiver; filter-integrated hybrid transceiver; flip-chip bonding; modified multichip bonding scheme; optical interconnection; packaging; subscriber access network; Bonding; Design optimization; Optical fiber networks; Optical filters; Optical interconnections; Packaging; Programmable control; Transceivers; WDM networks; Wavelength division multiplexing;
Conference_Titel :
Fibres and Optical Passive Components, 2005. Proceedings of 2005 IEEE/LEOS Workshop on
Print_ISBN :
0-7803-8949-2
DOI :
10.1109/WFOPC.2005.1462143
