DocumentCode :
3506724
Title :
The sub-model method for analysis of BGA joint stress and strain during random vibration loading
Author :
Xie Haijun ; Zhou Dejian ; Liu Zhengwei
Author_Institution :
Sch. of Mech. & Eng., Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1216
Lastpage :
1221
Abstract :
This paper put forward a equivalent approach of high-density PCB assembly model, then use of sub-model on the local position of a second analytical solution. Firstly, the equivalent model, fine model and sub-model was established, and then modal analysis, random vibration analysis and sub-model analysis are performed. Comparison with the result data of the three models, it is verified the feasibility and correctness using of equivalent processing and sub-modeling techniques from the natural frequencies, mode, and stress distribution, maximum stress, maximum stress location, relative error of the maximum stress of the equivalent part. It is an effective method to analysis of high-density PCB assembly model. Finally, it is used the method to obtain the dynamic response of a particular high-density PCB assembly model under random vibration load.
Keywords :
ball grid arrays; modal analysis; printed circuit manufacture; random processes; stress-strain relations; vibrations; BGA; equivalent processing; high-density PCB assembly model; joint stress-strain; maximum stress location; modal analysis; natural frequencies; random vibration analysis; random vibration loading; stress distribution; submodel analysis; Analytical models; Assembly; Deformable models; Joints; Load modeling; Stress; Vibrations; BGA; high-density assembly; random vibration; sub-model method;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474825
Filename :
6474825
Link To Document :
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