Equivalent circuit modeling of single and coupled on-chip interconnects on lossy silicon substrate

Author

Zheng, J. ; Hahm, Y.C. ; Weisshaar, A. ; Tripathi, V.K.

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

fYear

1999

fDate

1999

Firstpage

185

Lastpage

188

Abstract

A CAD-oriented modeling approach for on-chip interconnects on lossy silicon substrates is presented. The frequency-dependent line parameters for single and coupled interconnects are obtained by a modified spectral domain approach that takes into account both the shunt and longitudinal substrate currents. Equivalent circuit models with ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE-compatible models is in excellent agreement with the frequency-dependent characteristics of the interconnects

Keywords

SPICE; circuit CAD; electric current; equivalent circuits; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; lumped parameter networks; spectral-domain analysis; CAD-oriented modeling; SPICE-compatible models; Si; broadband characteristics; coupled on-chip interconnects; equivalent circuit modeling; equivalent circuit models; frequency-dependent interconnect characteristics; frequency-dependent line parameters; ideal lumped elements; longitudinal substrate current; lossy silicon substrate; modified spectral domain approach; on-chip interconnects; shunt substrate current; single on-chip interconnects; Coupling circuits; Doping; Equivalent circuits; Frequency; Impedance; Integrated circuit interconnections; Laplace equations; Silicon; Substrates; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1999

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5597-0

Type

conf

DOI

10.1109/EPEP.1999.819222

Filename

819222