Title :
77 GHz band surface mountable ceramic package
Author :
Koriyama, Shinichi ; Kitazawa, Kenji ; Minamiue, Hidehiro ; Fujii, Mikio
Author_Institution :
R&D Center, Kyocera Corp., Kagoshima, Japan
Abstract :
We have developed a ceramic package for 77 GHz millimeter wave applications. The package has a new terminal structure for surface mount, and a feedthrough for electromagnetic coupling. We confirmed that the surface mounted package shows high transmission characteristics
Keywords :
MIMIC; ceramic packaging; electromagnetic coupling; integrated circuit interconnections; integrated circuit packaging; surface mount technology; 77 GHz; ceramic package; electromagnetic coupling; feedthrough; millimeter wave applications; package terminal structure; surface mount; surface mountable ceramic package; surface mounted package; transmission characteristics; Ceramics; Costs; Dielectric losses; Electromagnetic coupling; Microstrip; Millimeter wave radar; Millimeter wave technology; Packaging; Signal design; Surface waves;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819231
