Title :
A test probe for TSV using resonant inductive coupling
Author :
Rashidzadeh, R. ; Basith, Iftekhar Ibne
Author_Institution :
Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada
Abstract :
A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15μm apart.
Keywords :
Couplings; Inductors; Probes; RLC circuits; Resonant frequency; Testing; Through-silicon vias;
Conference_Titel :
Teletraffic Congress (ITC), 2013 25th International
Conference_Location :
Shanghai
DOI :
10.1109/ITC.2013.6917153
