DocumentCode :
3512388
Title :
A test probe for TSV using resonant inductive coupling
Author :
Rashidzadeh, R. ; Basith, Iftekhar Ibne
Author_Institution :
Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada
fYear :
2013
fDate :
10-12 Sept. 2013
Firstpage :
1
Lastpage :
10
Abstract :
A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15μm apart.
Keywords :
Couplings; Inductors; Probes; RLC circuits; Resonant frequency; Testing; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Teletraffic Congress (ITC), 2013 25th International
Conference_Location :
Shanghai
Type :
conf
DOI :
10.1109/ITC.2013.6917153
Filename :
6917153
Link To Document :
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