DocumentCode :
3515191
Title :
A systematic design approach to thermal-electrical power electronics integration
Author :
Cottet, Didier ; Drofenik, Uwe ; Meyer, Jean-Marc
Author_Institution :
Corp. Res., ABB Switzerland Ltd., Baden-Dattwil
fYear :
2008
fDate :
1-4 Sept. 2008
Firstpage :
219
Lastpage :
224
Abstract :
With the growing demand for integration density of power electronic systems, efficient multi-domain simulations are becoming indispensable design tools. This paper therefore presents a systematic simulation approach for coupled thermal-electrical design of power modules and systems. The presented solution is based on coupled thermal-electrical equivalent circuits and consists of optimized algorithms for accelerating the simulations by orders of magnitude, while keeping the required accuracy. With this type of simulation, load cycles for complete mission profiles can be computed and used for thermal management, reliability and lifetime estimations of power electronic systems.
Keywords :
power electronics; thermal management (packaging); thermoelectric devices; thermoelectric power; coupled thermal-electrical equivalent circuits; lifetime estimations; power electronic systems; power modules; reliability; thermal management; thermal-electrical power electronics integration; Acceleration; Circuit simulation; Computational modeling; Coupling circuits; Equivalent circuits; Multichip modules; Power electronics; Power system reliability; Thermal loading; Thermal management of electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
Type :
conf
DOI :
10.1109/ESTC.2008.4684353
Filename :
4684353
Link To Document :
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