DocumentCode
3515480
Title
X-ray lithography: overview and outlook
Author
Silverman, J.P.
Author_Institution
Semicond. Res. & Dev. Center, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1998
fDate
3-8 May 1998
Firstpage
85
Abstract
Summary form only given. The authors describes X-ray lithography (XRL) and current results from various laboratories around the world. The status and challenges associated with the various technology elements (the source, the optics, the aligner, the mask, and the photoresist) are discussed. Finally, the outlook for successfully inserting XRL into semiconductor manufacturing are assessed.
Keywords
X-ray lithography; X-ray masks; integrated circuit technology; resists; semiconductor technology; X-ray lithography overview; aligner; electron resists; laboratories; mask; optics; photoresist; semiconductor manufacturing; technology elements; Gas lasers; Integrated circuit technology; Laboratories; Lenses; Optical device fabrication; Optical pulses; Optical sensors; Plasma sources; Ultraviolet sources; X-ray lithography;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
1-55752-339-0
Type
conf
DOI
10.1109/CLEO.1998.675900
Filename
675900
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