Title :
3D-Mintegration: The design and manufacture of 3D miniaturised integrated products
Author :
Desmulliez, M.P.Y. ; Topham, D.
Author_Institution :
Microsyst. Eng. Centre, Heriot-Watt Univ., Edinburgh
Abstract :
Integration on silicon is a mature procedure: well-tried compatible processes and well-characterised design methods routinely turn fantastic ideas into everyday commodities. But whole-product integration is another matter. This paper describes a UK-leading project to identify and develop revolutionary off-silicon manufacturing processes and to foster the insertion of these ground-breaking techniques into industry. Particular emphasis is placed upon the unexpected need for revisions of design philosophy to make the most of the new manufacturing techniques.
Keywords :
elemental semiconductors; integrated circuit packaging; silicon; 3D miniaturised integrated products; 3D-Mintegration; UK-leading project; off-silicon manufacturing processes; well-tried compatible processes; Assembly; Costs; Manufacturing industries; Manufacturing processes; Microassembly; Packaging; Product design; Prototypes; Semiconductor device manufacture; Silicon;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684442