Strain-rate effects on mechanical properties for SAC387 and SAC105-Y solder

Author

Xu, Luhua ; Tan, Kok Ee ; Pang, John H L

Author_Institution

Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

845

Lastpage

850

Abstract

In this paper, solder alloy of Sn-3.8Ag-0.7Cu (SAC387) and Sn-1.0Ag-0.5Cu-Y (SAC105-Y), where Y is a small addition of a fourth element, were tested at room temperature to study the strain-rate-dependent elastic modulus and yield strength of the solder. Nano-indentation tests were conducted at various strain rates from 10^-3 to 10¹ 1/s by using the continuous stiffness measurement (CSM) technique. Microstructures of the IMC for SAC105-Y on NiAu surface finish and OSP surface finish were investigated prior to the nano-indentation tests. Based on the test results, the higher the strain rate the higher the elastic modulus and yield stress of the solder. The power law relationship is used to curve fit the strain-rate-dependent yield stress with the indentation strain rate.

Keywords

copper alloys; deformation; elastic moduli; impact testing; nanoindentation; nickel alloys; silver alloys; solders; tin alloys; yield strength; NiAu; SnAgCu-Y; continuous stiffness measurement; drop impact; elastic modulus; nanoindentation tests; solder alloys; strain-rate effects; temperature 293 K to 298 K; yield strength; Capacitive sensors; Environmentally friendly manufacturing techniques; Lead; Mechanical factors; Silver; Soldering; Strain measurement; Stress measurement; Temperature; Testing; continuous stiffness measurement; drop impact; nano-indentation; solder joint; strain-rate;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684462

Filename

4684462