Title :
Solder bumping for flip-chips with an electro-magnetic actuator
Author :
Kessling, O.S. ; Irlinger, F. ; Lueth, T.C.
Author_Institution :
Dept. of Micro Technol. & Med. Device Technol., Tech. Univ. Munchen, Munich
Abstract :
This paper reports an actuator for printing solder. Different types of solder can be printed: Sn63Pb37, Sn100, Sn96Ag4, and Sn97Cu3. The primary application of the print head is the field of flip-chip bumping. The advantage in this case is the flexible generation of solder balls on a circuit board without the need of using a screen printing mask.
Keywords :
copper alloys; electromagnetic actuators; flip-chip devices; integrated circuit interconnections; lead alloys; silver alloys; soldering; tin; tin alloys; SnAg; SnCu; SnPb; chip substrate interconnection; electro-magnetic actuator; flip-chips; print head; solder bumping; thermal stress; Coils; Glass; Head; Lead; Manufacturing; Piezoelectric actuators; Printing; Temperature; Thermal stresses; Wire;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684485
