Title :
Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs
Author :
Schacht, R. ; Wunderle, B. ; May, D. ; Abo Ras, M. ; Faust, W. ; Michel, B. ; Reichl, Herbert
Author_Institution :
Fraunhofer Inst. Reliability & Microintegration, Berlin
Abstract :
This paper derives and evaluates an effective thermal material simulation model in simula-tion and experiment as well as proposes a non-destructive failure analysis for multi-layer sub-strates with thermal or electrical vias to derive exact failure data to supplement existing life-time models.
Keywords :
crack detection; infrared imaging; multilayers; nondestructive testing; organic compounds; printed circuits; PCB; crack growths; electrical excitation; laser excitation; nondestructive tests; organic multilayer; pulse IR thermography; thermal material simulation model; thermal via-structures; Analytical models; Copper; Electronic packaging thermal management; Failure analysis; Laser excitation; Materials testing; Nondestructive testing; Optical materials; Thermal resistance; Transmission line matrix methods; 3D com-puter tomography; Thermal via; effective thermal material simulation model; laser excitation; multi layer PCB; non-destructive failure analytic method; pulse IR-thermography;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684489
