• DocumentCode
    3517653
  • Title

    MicroLens/UV-LED array packaging for dynamic and static alignment

  • Author

    Luetzelschwab, M. ; Desmulliez, Marc Philippe Y. ; Weiland, D.

  • Author_Institution
    Microsyst. Eng. Centre, Heriot-Watt Univ., Edinburgh
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    1121
  • Lastpage
    1126
  • Abstract
    This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120degC.
  • Keywords
    electronics packaging; light emitting diodes; microlenses; photoresists; ultraviolet lithography; SU8 photoresist; THB photoresist; UV-lithography; active alignment; microLens-UV-LED array packaging; static alignment; Bonding; Electrodes; Electrostatic actuators; Fabrication; Insulation life; Lenses; Light emitting diodes; Manufacturing processes; Microoptics; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684509
  • Filename
    4684509
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3517653