DocumentCode :
3518204
Title :
Bumping technologies of fine-pitch BGA components
Author :
Bátorfi, Réka ; Szöke, Péter ; Oláh, Zoltán ; Géczy, Attila ; Ruszinkó, Miklós ; Vitéz, Zsolt Illyefalvi
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear :
2010
fDate :
12-16 May 2010
Firstpage :
107
Lastpage :
112
Abstract :
The assembling technology of fine-pitch Ball Grid Arrays (BGAs) is used for high-end applications such as technology of very high density circuits and package-on-package structures. Vapor phase soldering is a perspective technology, but as it is still not very widespread in the industry and in research laboratories, there are a lot of things to examine to standardize the process and to get more experiences. SAC solder bumps made with different technologies were compared to each other and to bumps of commercial BGA components. Another aim was to determine the limits of our laboratory facilities in bumping and PWB technologies. Bumping experiments were carried out on model BGA components with stencil printing, reflowed with vapor phase and with applying solder with mini-wave selective soldering equipment. The optimization of the solder amount and the appropriate technology was in the focus of our research. To have acceptable, high, uniform and good quality bumps, we developed these processes with parameter optimization.
Keywords :
ball grid arrays; soldering; PWB technologies; SAC solder bumps; ball grid arrays; bumping technologies; fine-pitch BGA components; miniwave selective soldering equipment; package-on-package structures; stencil printing; vapor phase soldering; very high density circuits; Apertures; Copper; Layout; Printing; Resists; Soldering; Springs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7849-1
Electronic_ISBN :
978-1-4244-7850-7
Type :
conf
DOI :
10.1109/ISSE.2010.5547270
Filename :
5547270
Link To Document :
بازگشت