Title :
Study on the microstructure and the Shear Strength of Sn-0.7Cu-xZn
Author :
Gao, Yan-Jun ; Luo, Zhong-Bing ; Zhao, Jie ; Wang, Lai
Author_Institution :
Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China
Abstract :
The effects of 0.3 wt.% Zn and 1 wt.% Zn addition on the melting point, the microstructure and the shear strength of Sn-0.7Cu were investigated. With small amount of Zn addition, the melting point decreased a little, and refined microstructure was observed especially for Sn-0.7Cu-1Zn and the fraction of eutectic region increased. Cu-Zn intermetallic compounds (IMCs) were detected in Sn-0.7Cu-1Zn at the phase boundary between beta-Sn and eutectic region. Shear strength of solders increased with strain rate lineally in log-log plot. The strength of Sn-0.7Cu-1Zn was much higher than that of Sn-0.7Cu, which was similar to that of Sn-0.7Cu-0.3Zn. Ductile fracture was observed in all solders.
Keywords :
copper alloys; ductile fracture; eutectic structure; shear strength; solders; tin alloys; zinc alloys; SnCuZn; ductile fracture; eutectic region; intermetallic compounds; melting point; microstructure; phase boundary; shear strength; solders; Aging; Capacitive sensors; Environmentally friendly manufacturing techniques; Lead; Materials science and technology; Microstructure; Soldering; Temperature; Testing; Zinc;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270550
