Committing of electronic modules by ball pins and their reliability

Author

Svecová, Olga ; Kosína, Petr ; Sandera, Josef ; Adámek, Martin

Author_Institution

Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic

fYear

2010

fDate

12-16 May 2010

Firstpage

259

Lastpage

262

Abstract

The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20°C to +100°C with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer LTCC ceramics. Test samples are soldered on to boards with various surface finishes: galvanic gold and HAL. The goal of the experiment is to determine the lifetime of ball solder joints in relation to varying thermal conductivity coefficient of base materials.

Keywords

ball grid arrays; circuit reliability; copper alloys; printed circuits; silver alloys; solders; tin alloys; SnAgCu; alumina ceramics; ball pins; ball solder joints; electronic modules; four-layer LTCC ceramics; galvanic gold; lead-free solder balls; printed circuit board; reliability measurement; surface finishes; temperature -20 degC to 100 degC; thermal conductivity coefficient; time 20 min; Ceramics; Pins; Reliability; Soldering; Substrates; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2010 33rd International Spring Seminar on

Conference_Location

Warsaw

Print_ISBN

978-1-4244-7849-1

Electronic_ISBN

978-1-4244-7850-7

Type

conf

DOI

10.1109/ISSE.2010.5547299

Filename

5547299