DocumentCode
3518845
Title
Analysis of coupled simultaneous switching noise induced from power delivery network in adjacent switching circuit
Author
Kim, Jongmin ; Song, Ki-Jae ; Yoo, Jongwoon ; Nah, Wansoo
Author_Institution
Sch. of Inf. & Commun. Eng., Sungkyunkwan Univ., Suwon, South Korea
fYear
2009
fDate
9-11 Dec. 2009
Firstpage
968
Lastpage
972
Abstract
This paper investigates the estimation of the coupled simultaneous switching noise (SSN) induced from power delivery networks (PDNs) in memory test boards. When the signal changes its reference plane in the board, voltage fluctuation occurs that induces the SSN in the PDN. This induced SSN affects other signals in the test board, reducing signal quality and test reliability. To avoid this problem, precise analysis and modeling become necessary. To demonstrate the analysis model, we designed and fabricated a 6-layer printed circuit board (PCB) on which 11 clock buffers (noise sources) and signal traces (victim lines) were installed. The scattering parameters were measured from 10 MHz to 3 GHz, and the signals in the victim lines were also measured using 20 GHz bandwidth oscilloscope. The PDN impedances and transfer characteristics with/without decoupling capacitors were simulated using both full-wave and circuit simulations, which coincide quite well with the measured data. Finally, we confirm the validity of the proposed simulation model, and we propose a design methodology to minimize the coupled SSN by installing decoupling capacitors on the test board.
Keywords
S-parameters; capacitors; circuit reliability; clocks; printed circuit design; switching circuits; 6-layer printed circuit board design; PDN impedances; adjacent switching circuit; bandwidth 20 GHz; bandwidth oscilloscope; clock buffers; coupled simultaneous switching noise analysis; decoupling capacitors; frequency 10 MHz to 3 GHz; memory test boards; power delivery network; scattering parameters; signal quality; test reliability; voltage fluctuation; Capacitors; Circuit noise; Circuit simulation; Circuit testing; Coupling circuits; Printed circuits; Signal analysis; Signal design; Switching circuits; Voltage fluctuations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location
Singapore
Print_ISBN
978-1-4244-5099-2
Electronic_ISBN
978-1-4244-5100-5
Type
conf
DOI
10.1109/EPTC.2009.5416402
Filename
5416402
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