Title :
Simulation and experimental study on temperature field of fluid jet-dispenser
Author :
Ding, Zhengrong ; Hu, Hao ; Deng, Guiling
Author_Institution :
Key Lab. of Modern Complex Equip. Design & Extreme Manuf., Central South Univ., Changsha, China
Abstract :
Fluid jet-dispensing technology has been widely used in micro-electronic encapsulation industry. The fluid viscosity varies as temperature changes, while it affects the process remarkably. Besides basic method on temperature field solution, some thermal behaviors, including heat conduction and heat exchange, boundary conditions and some physical parameters are overall analyzed in this paper. Based on the simulation software platform ANSYS, a two-dimensional transient temperature field model of jet-dispenser was built, and simulation programs on temperature field for two sorts of fluid with obviously different thermal conductivity were performed. Then heating experiments were finished to validate the feasibility of FEA, and results show that temperature distribution is homogeneous along fluid area and it meets the conditions of jetting.
Keywords :
finite element analysis; jets; thermal management (packaging); viscosity; ANSYS simulation software platform; finite element analysis; fluid jet-dispenser; fluid viscosity; heat conduction; heat exchange; micro-electronic encapsulation; temperature field; Boundary conditions; Fluid flow control; Heat transfer; Heating; Temperature control; Temperature distribution; Temperature sensors; Thermal conductivity; Thermal force; Viscosity;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270569
