Effects of thermal aging on the electrical resistance of Sn-3.5Ag micro SOH solder joints

Author

Peng, Jin ; Wu, Fengshun ; Liu, Hui ; Zhou, Longzao ; Pan, Qilin

Author_Institution

Wuhan Nat. Lab. for Optoelectron., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

1023

Lastpage

1026

Abstract

The relationship among the electrical resistance, the thickness of the IMC layer and the aging timer of the micro SOH solder joints is investigated in present paper. It´s found that the composition of compositions of the intermetallic compounds are Cu₃Sn near the Cu side and Cu₆Sn₅ near the solder side; With the increasing of aging time, the thickness of the Cu₃Sn increased while the thickness of the Cu₆Sn₅ decreased. The total thickness of IMCs (Cu₆Sn₅ and Cu₃Sn) increased as the aging time increased, while the resistance of the micro SOH solder joints increased at first and then decreased. The resistance of solder joints increased at first and then decreased as the total thickness of IMCs (Cu₆Sn₅ and Cu₃Sn) increased.

Keywords

ageing; copper alloys; electric resistance; electronics packaging; metallisation; silver alloys; soldering; thermal stresses; tin alloys; Cu₃Sn; Cu₆Sn₅; Sn-Ag; electrical resistance; intermetallic compound layer; micro SOH solder joints; stand-off height; thermal aging; Aging; Bars; Electric resistance; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Materials science and technology; Packaging; Soldering; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270577

Filename

5270577