Title :
Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis
Author :
Song, Fubin ; Newman, Keith ; Yang, Chaoran ; Lee, S. W. Ricky
Author_Institution :
Electron. Packaging Lab., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
Abstract :
Board level solder joint reliability was evaluated using a 4-point monotonic bending test on different BGA package assemblies, including a 51 × 51 mm 2400 CBGA and a 40 × 40 mm 1517 PBGA. The edgebond epoxy was applied between the package samples and solder-attached printed wiring boards (PWBs). During the bending test, the PWB strain, bending force and daisy-chain resistance were monitored in real time. The daisy-chain resistance and PWB strain-rate during the bending test were cross-referenced for detailed comparison. The test results indicated that the PWB strain-rate showed an obvious change at the moment of package failure. The PWB strain-rate can be a useful monitoring method for detecting the onset of the solder joint failure during the monotonic bending test.
Keywords :
ball grid arrays; bending; electric resistance; electronics industry; mechanical testing; printed circuits; reliability; solders; 4-point monotonic bending test; CBGA; PBGA; PWB; bending force; board level solder joint reliability; daisy-chain resistance; edgebond epoxy; lead-free BGA; package failure; printed wiring boards; solder joint failure; strain rate analysis; Assembly; Capacitive sensors; Circuit testing; Condition monitoring; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit interconnections; Lead; Soldering; Wiring;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416422
