Microchannel water cooling for LTCC based microsystems

The heat dissipation of six different types of microchannel networks integrated in LTCC based microsystems has been investigated by experimental measurement and simulation analysis, including straight, serpentine, spiral and fractal-shaped microchannel networks of curve, I-shaped and parallel. The cross section of microchannel is 200 ¿m × 200 ¿m and the total length is about 200 mm. The water mass flow rate at the inlet was controlled at 7.5 ml/min by a powerful micro-bump and the heat flux of surface heating area was supplied from 0.2 W/cm² to 1 W/cm² by an array of chip resistors. The simulated maximum temperature rise by finite volume method agrees well with the experimental results. It is found that the spiral microchannel has the best cooling ability and reduces 86.8% of the maximum temperature rise at 1 W/cm². The microchannels are proved to have little effect on the strength of the substrate by finite element analysis method due to the small size of cross section.