Title :
Depiction of the elastic anisotropy of AuSn4 and AuSn2 from first-principles calculations
Author :
An, Rong ; Wang, Chunqing ; Tian, Yanhong
Author_Institution :
Sch. of Chem. Eng. & Technol., Harbin Inst. of Technol., Harbin, China
Abstract :
As the solder joints become increasingly small and contain only a few grains, their mechanical properties cannot be determined from conventional mechanical tests as with bulk samples, and there may be a considerable variation in mechanical behavior from joint to joint because of the anisotropy of mechanical properties. In this paper, elastic constants of single-crystal AuSn4 and AuSn2 were preliminarily determined through first-principles calculations to characterize their polycrystalline elastic behavior and elastic anisotropy. The ideal bulk, shear, and Young´s moduli, as well as Poisson´s ratios were determined using the Voigt-Reuss-Hill method. These compounds exhibited distinct anisotropy in Young´s modulus, which may be partially responsible for the discrepancy in the experimental results.
Keywords :
Poisson ratio; Young´s modulus; anisotropic media; elastic constants; gold alloys; reliability; solders; tin alloys; AuSn2; AuSn4; Poisson´s ratios; Voigt-Reuss-Hill method; Young´s moduli; bulk moduli; elastic anisotropy; first-principles calculations; mechanical properties; polycrystalline elastic behavior; shear moduli; single-crystal elastic constants; solder joints reliability; Anisotropic magnetoresistance; Chemical technology; Crystallization; Electronic equipment testing; Electronics packaging; Gold; Intermetallic; Materials science and technology; Mechanical factors; Soldering;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270675