Title :
Nano resonator simulation fabrication and packaging consideration
Author :
Zhang, Wei ; Liu, Zewen ; Wang, Zheng
Author_Institution :
Inst. of Microelectron., Tsinghua Univ. Beijing, Beijing, China
Abstract :
A study on simulation, fabrication and packaging of metallic nano resonator is presented. The nano resonator is modeled with an equivalent circuit and simulated using HSPICE. CMOS compatible process is used to fabricate the nano resonator with a minimum modification The suspended part of the device is released using HF vapor-phase etching. Packaging of nanoscale device is conceived based on the features, fabrication process and the application of the nano resonator.
Keywords :
equivalent circuits; nanoelectromechanical devices; nanofabrication; resonators; semiconductor device packaging; sputter etching; CMOS compatible process; HF vapor-phase etching; HSPICE; equivalent circuit; metallic nano resonator simulation fabrication; nanofabrication process; nanoscale device packaging; Circuit simulation; Dielectric materials; Fabrication; Nanoelectromechanical systems; Nanoscale devices; Packaging; RLC circuits; Resonant frequency; Semiconductor materials; Temperature sensors;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270700
