Title :
Miniaturized printed wire antenna in package for 2.4GHz wireless communications
Author :
Liu, Xiaoli ; Wang, Yunfeng ; Li, Lei ; Wan, Lixi
Author_Institution :
Shenzhen Inst. of Adv. Integration Technol., Chinese Univ. of Hong Kong, Shenzhen, China
Abstract :
Miniaturized printed wire antennas in system in package were investigated for 2.4 GHz wireless communication systems. An inverted F antenna was proposed, and had a small area with 15 mm by 15 mm. The position of feed tap connected to the antenna arm greatly influenced the impedance of antenna, namely, it could adjust the position of feed tap to match the impedance to 50 ohm. The influences of chips and epoxy molding compounds on the impedance were also studied. Eventually, the inverted F antenna in package had a bandwidth and gain with almost 200 MHz and 2.8 dB, respectively, and could meet the demands of 2.4 GHz wireless communication.
Keywords :
UHF antennas; electronics packaging; microstrip antennas; planar inverted-F antennas; radiocommunication; bandwidth 200 MHz; epoxy molding compound; feed tap; frequency 2.4 GHz; gain 2.8 dB; inverted F antenna; miniaturized printed wire antenna; resistance 50 ohm; size 15 mm; system in package; wireless communications; Antenna feeds; Bandwidth; Bluetooth; Electronics packaging; Impedance; Joining processes; Shape; Wire; Wireless LAN; Wireless communication;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270719
