DocumentCode
352172
Title
A power reduction method for off-chip interconnects
Author
Devisch, Fredéric ; Stiens, Johan ; Vounckx, Roger ; Kuijk, Maarten
Author_Institution
LAMI, Univ. of Brussels, Belgium
Volume
4
fYear
2000
fDate
2000
Firstpage
265
Abstract
Off-chip interconnects with a length between 5 and 20 cm can typically be modeled as lumped capacitors for operating speeds up to 50-250 MHz. These capacitors can be driven in such a way that their energy is recycled, reducing the power dissipation. This can be achieved by one or more inductors that are included at the driving side allowing energy transfer from the logic level changing interconnects to the inductors and back. Since most of the energy is recycled, the dissipation for changing logic level is reduced considerably. The method is verified first on circuits designed in 0.5 μm CMOS at Vcc=3.3 V, rendering power reduction to 48% of conventional drivers at 10 MHz operating frequency and reduction to 58% at 40 MHz
Keywords
CMOS digital integrated circuits; driver circuits; interconnections; low-power electronics; 0.5 micron; 10 to 40 MHz; 3.3 V; 5 to 20 cm; CMOS circuits; RLC driving; drivers; energy recycling; inductors; lumped capacitor; off-chip interconnects; power dissipation; power reduction method; CMOS logic circuits; Capacitors; Driver circuits; Frequency; Inductors; Integrated circuit interconnections; Integrated circuit technology; Power dissipation; Printed circuits; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2000. Proceedings. ISCAS 2000 Geneva. The 2000 IEEE International Symposium on
Conference_Location
Geneva
Print_ISBN
0-7803-5482-6
Type
conf
DOI
10.1109/ISCAS.2000.858739
Filename
858739
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