DocumentCode :
3522552
Title :
Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools
Author :
Yek Bing Lee ; Strusevich, N. ; Bailey, Christopher ; Chun-Yan Yin ; Cartwright, Christopher
Author_Institution :
Sch. of Comput. & Math. Sci., Univ. Of Greenwich, London, UK
fYear :
2009
fDate :
10-13 Aug. 2009
Firstpage :
205
Lastpage :
208
Abstract :
This paper discusses the modelling tools used to predict the performance of a liquid crystal display using an array of light emitting diodes (LEDs) as the backlight. LEDs can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effect on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes the current modelling efforts underway in this multi-disciplinary UK funded project that aims at identifying the intricate relationships between the optical, thermal and mechanical behaviour when developing a ruggedized electronic display using an array of LEDs as the backlight.
Keywords :
LED displays; liquid crystal displays; semiconductor device packaging; semiconductor device reliability; thermal management (packaging); LED array; adaptive light control; display backlights; electronic display; integrated modelling; light emitting diode packaging; liquid crystal display; thermal management; Adaptive control; Light emitting diodes; Lighting control; Liquid crystal displays; Optical arrays; Optical design; Packaging; Predictive models; Programmable control; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
Type :
conf
DOI :
10.1109/ICEPT.2009.5270764
Filename :
5270764
Link To Document :
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