• DocumentCode
    3523976
  • Title

    Study on the dual-excited full-wavelength piezoelectric ultrasonic transducer

  • Author

    Liang, Zhao-feng ; Zhou, Guang-ping ; Mo, Xi-ping ; Li, Zheng-zhong

  • Author_Institution
    Dept. of Electron. Eng., Shenzhen Polytech., Shenzhen, China
  • fYear
    2011
  • fDate
    9-11 Dec. 2011
  • Firstpage
    208
  • Lastpage
    212
  • Abstract
    A cascade structure of half-wavelength transducer is proposed for improving power capacity of the transducer, and a dual-excited full-wavelength piezoelectric ultrasonic transducer consisting of two half-wavelength transducers is especially studied. Based on one-dimensional theory, the resonance and the anti-resonance frequency equations of the transducer are derived. The validity of the theoretical analysis is verified by using FEM software. The effect of the locations and volumes of the two piezoelectric ceramic stacks on effective electromechanical coupling factor keff of the transducer is also discussed. The results show that keff drops with both ceramic stacks moved away from the displacement nodes of their respective half-wavelength transducers, and first increases and then decreases with the increase of the volumes of the ceramic stacks. This study is useful for designing and optimizing the dual-excited full-wavelength transducer.
  • Keywords
    finite element analysis; piezoelectric transducers; ultrasonic transducers; FEM software; antiresonance frequency equations; ceramic stacks; displacement nodes; dual-excited full-wavelength piezoelectric ultrasonic transducer; electromechanical coupling factor; half-wavelength transducer cascade structure; one-dimensional theory; Ceramics; Couplings; Equations; Mathematical model; Resonant frequency; Transducers; Ultrasonic transducers; Dual-excited transducer; Electromechanical coupling factor; Equivalent circuit; Full-wavelength; Resonance frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Piezoelectricity, Acoustic Waves and Device Applications (SPAWDA), 2011 Symposium on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4673-1075-8
  • Type

    conf

  • DOI
    10.1109/SPAWDA.2011.6167228
  • Filename
    6167228