Title :
Boundary integrate equation method for semi-permeable vertical planar cracks in 3D piezoelectric media
Author :
Fan, Cui-ying ; Guo, Zheng-hua ; Zhao, Ming-hao ; Zhang, Rong-li ; Pan, Ernian
Author_Institution :
Sch. of Mech. Eng., Zhengzhou Univ., Zhengzhou, China
Abstract :
In this paper, the boundary integral equation method is developed to study a vertical planar crack under the electrically semi-permeable boundary condition. The crack face is parallel to the poling direction and normal to the plane of isotropy in three-dimensional (3D) transversely isotropic piezoelectric media. The result shows that the singularity order is still the ordinary r-1/2 at the crack tip. The mode I stress intensity factor is related only to the displacement discontinuity or the mechanical loading in the normal direction of the crack plane, whilst the other field intensity factors are coupled together by other extended displacement discontinuities. When the crack is extended infinitely in the y-direction, the problem is reduced to a two-dimensional (2D) one, and the corresponding coupling behavior is simplified.
Keywords :
boundary integral equations; cracks; electromechanical effects; loading; piezoelectric materials; 3D piezoelectric media; boundary integrate equation method; crack face; crack plane; crack tip; electrically semi-permeable boundary condition; mechanical loading; mode I stress intensity factor; semi-permeable vertical planar crack; three-dimensional transversely isotropic piezoelectric media; Boundary conditions; Couplings; Equations; Face; Integral equations; Media; Three dimensional displays; Boundary integrate equation method; Field intensity factor; Piezoelectric medium; Vertical crack;
Conference_Titel :
Piezoelectricity, Acoustic Waves and Device Applications (SPAWDA), 2011 Symposium on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-1075-8
DOI :
10.1109/SPAWDA.2011.6167260