DocumentCode :
3527469
Title :
Periodic thermal management for hard real-time systems
Author :
Long Cheng ; Kai Huang ; Gang Chen ; Biao Hu ; Knoll, Alois
Author_Institution :
Robot. & Embedded Syst., Tech. Univ. Muenchen, Munich, Germany
fYear :
2015
fDate :
8-10 June 2015
Firstpage :
1
Lastpage :
10
Abstract :
Due to growing power density, on-chip temperature increases rapidly, which has hampered the reliability and performance of modern real-time systems. This paper studies how to minimize the peak temperature for hard real-time systems under hard real-time constraints with periodic thermal management. A closed-form representation of the peak temperature for such a periodic scheme is derived to tackle this problem. Based on this closed-form and the arrival curve model which is used to model the system workload, two approaches that can derive periodic thermal management are proposed to minimize the peak temperature for a given event stream with a trade-off between complexity and accuracy. Case studies show that our approaches can achieve similar or better level of peak temperature but with two or three orders of magnitude lower computation expense compared to previous work.
Keywords :
microprocessor chips; real-time systems; reliability; temperature; arrival curve model; closed-form representation; hard real-time systems; on-chip temperature; periodic thermal management; power density; reliability; Decision support systems; Optical wavelength conversion; Rail to rail outputs; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Embedded Systems (SIES), 2015 10th IEEE International Symposium on
Conference_Location :
Siegen
Type :
conf
DOI :
10.1109/SIES.2015.7185040
Filename :
7185040
Link To Document :
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