DocumentCode
352895
Title
Thematic network “Adhesives in Electronics”. A two year review and future plans
Author
Kergel, Helmut
Author_Institution
VDI/VDE-Technologiezentrum Informationstechnik GmbH, Teltow, Germany
fYear
2000
fDate
2000
Firstpage
304
Lastpage
306
Abstract
In order to overcome the problems of the use of adhesives in electronics manufacturing, a so called “Thematic Network” on “Adhesive Joining Technology in Electronics Manufacturing (Adhesives in Electronics)” was launched March 1998. Within this project, which is funded by the European Community, 52 partners throughout Europe cooperate in order to exchange relevant information and to coordinate future fields for research and development
Keywords
adhesives; electronic equipment manufacture; research and development management; reviews; European Community; adhesives; electronics manufacturing; research and development; review; thematic network; Cost function; Databases; Electronics industry; Electronics packaging; Europe; Intelligent networks; Manufacturing; Production systems; Project management; Research and development;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location
Espoo
Print_ISBN
0-7803-6460-0
Type
conf
DOI
10.1109/ADHES.2000.860625
Filename
860625
Link To Document