Optimized flip-chip interconnect for 38 GHz thin-film microstrip multichip modules

Author

Ngoc-Hoa Huynh ; Heinrich, W. ; Hirche, K. ; Scholz, W. ; Warth, M. ; Ehrlinger, W.

Author_Institution

Ferdinand-Braun-Inst. fur Hochstfrequenztech., Berlin, Germany

Volume

1

fYear

2000

fDate

11-16 June 2000

Firstpage

69

Abstract

Flip-chip interconnects with 80 /spl mu/m bumps are optimized for 38 GHz by means of electromagnetic simulation. Thin-film microstrip is used as transmission-line on the carrier substrate. A compensation structure reduces reflections at the interconnect below -20 dB. Measurements of a passive structure and active chip modules proved the feasibility of this approach.

Keywords

MIMIC; circuit optimisation; circuit simulation; compensation; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; microstrip lines; multichip modules; 38 GHz; 80 micron; active chip modules; carrier substrate; compensation structure; electromagnetic simulation; optimized flip-chip interconnect; passive structure; thin-film microstrip multichip modules; Bonding; Capacitance; Coplanar waveguides; Frequency; Integrated circuit interconnections; Microstrip; Multichip modules; Substrates; Transistors; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest. 2000 IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-7803-5687-X

Type

conf

DOI

10.1109/MWSYM.2000.860887

Filename

860887