Title :
3-axis amorphous wire type giant magneto-impedance sensors
Author :
Cai, C.M. ; Yamamoto, M. ; Aoyama, H. ; Mori, M. ; Honkura, Y.
Author_Institution :
Aichi Steel Corp., Japan
Abstract :
In the previous, the author reported a 2-axis mass-production of an amorphous wire GMI (giant magneto-impedance) sensor with 10,000 times the sensitivity of the MR sensor. This paper presents a newly developed 3-axis amorphous wire type GMI sensors by adding a new Z axis. The 3D GMI sensor has three orthogonally arranged micro GMI sensor elements and a CMOS signal conditioning IC in a small resin-mold package. And the length of GMI sensor element was shortened from 1.5 mm to 0.8 mm. The world´s smallest, quick response and low power consumption 3D sensor can be used in mobile phones with GPS capability as an electronic compass.
Keywords :
CMOS integrated circuits; giant magnetoresistance; magnetic sensors; resins; 1.5 to 0.8 mm; 3-axis amorphous wire; CMOS; GMI sensors; GPS capability; electronic compass; giant magneto-impedance sensors; mobile phones; resin-mold package; Amorphous magnetic materials; Amorphous materials; CMOS integrated circuits; Electronics packaging; Energy consumption; Global Positioning System; Integrated circuit packaging; Magnetic sensors; Mobile handsets; Wire;
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
DOI :
10.1109/INTMAG.2005.1463632
