DocumentCode
3532012
Title
An All CMOS Temperature Sensor for Thermal Monitoring of VLSI Circuits
Author
Ren, Yi ; Wang, Chenxu ; Hong, Hong
Author_Institution
Microelectron. Centre, Harbin Inst. of Technol. Harbin, Harbin
fYear
2009
fDate
28-29 April 2009
Firstpage
1
Lastpage
5
Abstract
Power and thermal considerations are becoming limiting factors for submicron circuits as technology scales down. In order to detect abnormal temperature changes so as to detect defects on chip, and increase reliability and service life of devices, an all CMOS temperature sensor for submicron circuits´ test is proposed. A current proportion to absolute temperature is generated for achieving linear temperature-dependent voltage and zero temperature coefficient voltage. A voltage-to-pulse generator instead of voltage or current analog- to-digital converter is utilized for translating voltage into a pulse with width proportional to the measured temperature. The SMIC 0.18 um model was chosen for design. The proposed smart sensor was measured to have an error of -1.0~1.0degC at most after two point calibration over the full rang of -50~150degC for thermal testing or self-heat monitoring. The power consumption is 135.9 muW at a sampling rate of 100 samples per second. This temperature sensor increases the system reliability by detecting heat points and predicting eventual faults caused by excessive chip temperature.
Keywords
CMOS integrated circuits; VLSI; temperature measurement; temperature sensors; thermal analysis; CMOS temperature sensor; SMIC model; VLSI circuits; power 135.9 muW; power consumption; sampling rate; self-heat monitoring; size 0.18 mum; smart sensor; temperature -1 C to 1 C; temperature -50 C to 150 C; temperature sensor; thermal monitoring; voltage-to-pulse generator; CMOS technology; Circuit testing; Life testing; Monitoring; Pulse measurements; Temperature measurement; Temperature sensors; Thermal factors; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Testing and Diagnosis, 2009. ICTD 2009. IEEE Circuits and Systems International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-2587-7
Type
conf
DOI
10.1109/CAS-ICTD.2009.4960775
Filename
4960775
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