DocumentCode
3533348
Title
Research on the Characteristic Test of Via Holes in Microwave Circuits
Author
Tian, Yu ; Liu, Yu ; Tong, Ling ; Liu, Jinxian
Author_Institution
Coll. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear
2009
fDate
28-29 April 2009
Firstpage
1
Lastpage
4
Abstract
The detailed design and analysis for measuring characteristics of via holes in microwave circuits are presented, including the design of devices under test(DUT) and the test fixtures. Then the methodology of de-embedding based on TRL calibration is introduced which can help to extract the scattering parameters of via holes from the original measured data. The methodology including design, measurement and analysis will help the study of microstrip via holes.
Keywords
design for testability; integrated circuit design; integrated circuit testing; microwave circuits; TRL calibration; characteristic test; devices under test; microwave circuits; via holes; Calibration; Circuit testing; Data mining; Design methodology; Fixtures; Microstrip; Microwave circuits; Microwave devices; Microwave measurements; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Testing and Diagnosis, 2009. ICTD 2009. IEEE Circuits and Systems International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-2587-7
Type
conf
DOI
10.1109/CAS-ICTD.2009.4960867
Filename
4960867
Link To Document