• DocumentCode
    3535147
  • Title

    Dielectric properties of silica hollow spheres/epoxy nanocomposites

  • Author

    Hong Zhou ; Dang, Zhimin ; Zha, Junwei ; Yong Fan ; Chen, Hao

  • Author_Institution
    Key Lab. of Eng. Dielectr. & its Applic., Harbin Univ. of Sci. & Technol., Harbin, China
  • fYear
    2012
  • fDate
    24-28 July 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Silica nanostructure hollow spheres were synthesized using template method and the silica hollow spheres/epoxy nanocomposite was prepared by adding the silica hollow spheres modified by aminophenyl trimethoxysilane (APTMOS) into the epoxy resin. Dielectric properties were investigated in terms of frequency and filler concentration. The results showed that the introduction of the silica hollow spheres hardly influenced the thermal stability behavior. With the increase of the silica hollow spheres content, the dielectric permittivity tended to decrease firstly and then increase. While the dissipation factor value increased slightly with an increase in frequency, it still remained at a low level. We found that the silica hollow spheres/epoxy composite containing 3wt% silica hollow spheres content possessed a low dielectric permittivity, a high dielectric strength but a low dielectric loss.
  • Keywords
    dielectric losses; dielectric properties; nanocomposites; permittivity; resins; thermal stability; APTMOS; aminophenyl trimethoxysilane; dielectric permittivity; dielectric properties; epoxy resin; filler concentration; frequency concentration; high dielectric strength; low dielectric loss; silica hollow sphere-epoxy nanocomposite; template method; thermal stability behavior; Heating; Nanocomposites; dielectric properties; epoxy resin; fillers; silica hollow spheres;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
  • Conference_Location
    Bangalore
  • ISSN
    2160-9225
  • Print_ISBN
    978-1-4673-2852-4
  • Type

    conf

  • DOI
    10.1109/ICPADM.2012.6318910
  • Filename
    6318910