DocumentCode
3535677
Title
Curing kinetics and dielectric properties of epoxy based nanocomposites
Author
Zhao, H.C. ; Zhang, X.Y. ; Han, Z.D.
Author_Institution
Sch. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China
fYear
2012
fDate
24-28 July 2012
Firstpage
1
Lastpage
4
Abstract
In this paper, epoxy based nanocomposites were prepared by adding inorganic alumina nano-particles and organic nitrile rubber nano-powders. The effects of two kinds of nano-particles on the curing kinetics of epoxy nanocomposites were investigated by differential scanning calorimetry (DSC). The dielectric properties of nanocomposites were evaluated in terms of volume resistivity (ρV), dielectric loss tangent (tgδ) and dielectric constant (ε). The results show that the activation energy of nanocomposites with single kind of nano-particles was decreased while the one with two kinds of nano-particles was increased. The same curing mechanism of nanocomposites as epoxy resin was revealed according to the similar reaction order. The volume resistivity of the nanocomosites was in the same order with the pure epoxy resin. Meanwhile, the dielectric constants of the nanocomposites were increased thanks to the higher dielectric constants of alumina and nitrile rubber than epoxy resin. The mixed nano-particles contributed more to the dielectric constants and the dielectric loss tangent of the nanocomposites.
Keywords
alumina; curing; dielectric losses; differential scanning calorimetry; nanocomposites; nanoparticles; permittivity; reaction kinetics; resins; rubber; Al2O3; DSC; activation energy; curing kinetic property; dielectric constant; dielectric loss tangent; dielectric properties; differential scanning calorimetry; epoxy based nanocomposites; epoxy resin; inorganic alumina nanoparticles; organic nitrite rubber nanopowders; reaction order; volume resistivity; Curing; Heating; Lead; Mechanical factors; Nanocomposites; Nanoparticles; alumina; curing kinetics; dielectric properties; epoxy resin; nanocomposites; nitrile rubber;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
Conference_Location
Bangalore
ISSN
2160-9225
Print_ISBN
978-1-4673-2852-4
Type
conf
DOI
10.1109/ICPADM.2012.6318958
Filename
6318958
Link To Document