• DocumentCode
    3535892
  • Title

    Analysis of the SiC VJFET gate punch-through and its dependence with the temperature

  • Author

    Dubois, Fabien ; Bergogne, Dominique ; Tournier, D. ; Buttay, Cyril ; Meuret, Regis ; Morel, Herve

  • Author_Institution
    Lab. Ampere, Univ. de Lyon, Lyon, France
  • fYear
    2013
  • fDate
    2-6 Sept. 2013
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Turning off a SiC VJFET from INFINEON requires to apply a gate-to-source voltage comprised between the JFET gate threshold voltage and the punch-through voltage. Unfortunately, for applications operating over a large temperature range, these two limits vary with the temperature and reduce the useful blocking gate-to-source voltage range as the temperature rises. So, the punch-through temperature dependence is a very important feature for applications operating in a wide temperature range like aeronautic applications. This paper addresses the analysis and modeling of the punch-through phenomenon and its dependence to the temperature. The proposed model gives a good agreement with the experimental data.
  • Keywords
    junction gate field effect transistors; semiconductor device models; silicon compounds; wide band gap semiconductors; JFET gate threshold voltage; SiC; VJFET gate punch-through voltage analysis; aeronautic applications; gate-to-source voltage; punch-through temperature dependence; Current measurement; Logic gates; Temperature dependence; Temperature distribution; Temperature measurement; Threshold voltage; Voltage measurement; Device characterisation; Device modeling; High temperature electronics; JFET; Silicon Carbide (SiC);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications (EPE), 2013 15th European Conference on
  • Conference_Location
    Lille
  • Type

    conf

  • DOI
    10.1109/EPE.2013.6631963
  • Filename
    6631963