Title :
Effect of coupling agent on dielectric breakdown of glass-polyamideimide composite films prepared by sol-gel process
Author :
Iida, Kazuo ; Masaki, Hunetaka ; Makamura, S. ; Sawa, Goro
Author_Institution :
Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
Abstract :
We describe the distribution of glass particles in glass-polyamideimide (PAI) composite films prepared by the sol-gel process and discuss effects of the silane coupling agent and the interface between glass and PAI on their dielectric breakdown and their thermal degradation
Keywords :
composite insulating materials; composite material interfaces; electric breakdown; filled polymers; organic insulating materials; polymer films; sol-gel processing; dielectric breakdown; glass particles; glass-PAI interface; glass-polyamideimide composite films; silane coupling agent; sol-gel process; thermal degradation; Breakdown voltage; Composite materials; Dielectric breakdown; Glass; Polymer films; Rough surfaces; Silicon; Surface cracks; Surface roughness; Thermal engineering;
Conference_Titel :
Electrical Insulating Materials, 1995. International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
4-88686-047-8
DOI :
10.1109/ISEIM.1995.496579
