DocumentCode
354134
Title
Microwave flip chip and BGA technology
Author
Bedinger, J.M.
Author_Institution
Raytheon Electron. Corp., Dallas, TX, USA
Volume
2
fYear
2000
fDate
11-16 June 2000
Firstpage
713
Abstract
Topics discussed in this paper are flip chip and BGA packaging and related assembly issues important in the design of microwave power amplifier and integrated transceiver MMICs. Environmental stress, thermal management, electrical performance, and inspection issues associated with flip chip and ball-grid array packaging will be discussed. The selection of solders, insulating substrates and underfill, will be presented with supporting data for various materials and geometries.
Keywords
MMIC power amplifiers; ball grid arrays; encapsulation; flip-chip devices; inspection; microassembling; soldering; thermal management (packaging); transceivers; BGA technology; MMICs; assembly issues; electrical performance; environmental stress; flip chip technology; inspection; insulating substrates; integrated transceiver; microwave power amplifier; solders; thermal management; underfill; Assembly; Flip chip; MMICs; Microwave amplifiers; Microwave technology; Packaging; Power amplifiers; Thermal management; Thermal stresses; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location
Boston, MA, USA
ISSN
0149-645X
Print_ISBN
0-7803-5687-X
Type
conf
DOI
10.1109/MWSYM.2000.863282
Filename
863282
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