DocumentCode
3544129
Title
Incremental “model-build-test” validation exercise for a 1-D biomedical ultrasonic imaging array
Author
Powell, D.J. ; Wojcik, G.L. ; Desilets, C.S. ; Gururaja, T.R. ; Guggenberge, K. ; Sherrit, S. ; Mukherjee, B.K.
Author_Institution
Weidlinger Assoc., Los Altos, CA, USA
Volume
2
fYear
1997
fDate
5-8 Oct 1997
Firstpage
1669
Abstract
Quantitative validation is critical to the effective utilization of large-scale modeling in advanced biomedical ultrasonic imaging applications. This work describes an incremental “model-build-test” validation exercise centered around a nonproprietary, 5 MHz, 1D linear array design. The step-by-step sequence reported here includes piezoceramic slivers, slivers with matching and slivers with both backing and matching. Furthermore, prior to the fabrication process, all the active and passive material components are accurately characterized. PZFlex, an explicit time-domain finite element modeling package, is used to predict the performance of the incremental array components at each stage of the validation exercise. Deviations between experimental results and finite element predictions are identified and subsequently analyzed. Although the manufacturing techniques used do not push the current operational envelope, observed process effects should be relevant to today´s devices
Keywords
biomedical transducers; biomedical ultrasonics; finite element analysis; piezoceramics; piezoelectric transducers; time-domain analysis; ultrasonic transducer arrays; 1-D biomedical ultrasonic imaging array; 1D linear array design; 5 MHz; PZFlex; active material components; backing; fabrication process; incremental array components; incremental model-build-test validation exercise; large-scale modeling; manufacturing techniques; matching; operational envelope; passive material components; piezoceramic slivers; process effects; quantitative validation; step-by-step sequence; time-domain finite element modeling package; Biomedical acoustics; Biomedical imaging; Fabrication; Finite element methods; Large-scale systems; Packaging; Piezoelectric materials; Predictive models; Time domain analysis; Ultrasonic imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1997. Proceedings., 1997 IEEE
Conference_Location
Toronto, Ont.
ISSN
1051-0117
Print_ISBN
0-7803-4153-8
Type
conf
DOI
10.1109/ULTSYM.1997.663316
Filename
663316
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