• DocumentCode
    3544158
  • Title

    High on/off-ratio P-type oxide-based transistors integrated onto Cu-interconnects for on-chip high/low voltage-bridging BEOL-CMOS I/Os

  • Author

    Sunamura, H. ; Kaneko, Kunihiko ; Furutake, N. ; Saito, Sakuyoshi ; Narihiro, M. ; Ikarashi, N. ; Hane, M. ; Hayashi, Yasuhiro

  • Author_Institution
    LSI Res. Lab., Renesas Electron. Corp., Sagamihara, Japan
  • fYear
    2012
  • fDate
    10-13 Dec. 2012
  • Abstract
    A new P-type amorphous SnO thin-film transistor with high Ion/Ioff ratio of >104 is developed, for the first time, as a component to complement N-type IGZO transistors for on-chip voltage-bridging BEOL-CMOS I/Os on conventional Si-LSI Cu-interconnects (Fig. 1). Dedicated low-temperature (<;400°C) oxide-semiconductor processes are implemented to overcome several integration challenges (Fig. 2) with only one-mask addition using standard BEOL process tools (Fig. 3). We demonstrate high Ion/Ioff ratio of >104 and high-Vd capability (|Vbd|>40V) with gate-to-drain offset structure, showing superior properties over the previously reported values (Table 1). The SnO transistor is suited for the BEOL-CMOS I/O, which gives standard LSIs a special add-on function to control high voltage signals directly in smart society applications.
  • Keywords
    CMOS integrated circuits; amorphous semiconductors; copper; integrated circuit interconnections; large scale integration; thin film transistors; tin compounds; Cu; LSI interconnection; SnO; dedicated low-temperature oxide-semiconductor process; gate-to-drain offset structure; high on-off-ratio p-type oxide-based transistors; high voltage signal control; n-type IGZO transistors; on-chip high-low voltage-bridging BEOL-CMOS I/O; p-type amorphous thin-film transistor; standard BEOL process tools; Dielectrics; Logic gates; Materials; Ohmic contacts; Process control; Standards; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2012 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4673-4872-0
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2012.6479070
  • Filename
    6479070