DocumentCode :
3544177
Title :
The understanding of multi-level RTN in trigate MOSFETs through the 2D profiling of traps and its impact on SRAM performance: A new failure mechanism found
Author :
Hsieh, E.R. ; Tsai, Y.L. ; Chung, Steve S. ; Tsai, C.H. ; Huang, R.M. ; Tsai, C.T.
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2012
fDate :
10-13 Dec. 2012
Abstract :
The impact of multi-level RTN on SRAM cells bas been experimentally demonstrated on both planar and trigate CMOS devices. First, to study multi-level RTN, a simple experimental method has been developed to take the 2D profiling of multi-traps in both oxide depth (vertical) and channel(lateral) directions in the gate oxide. Then, the role of traps in the switching mechanisms of SRAM cells has also been examined. Results show that the multi-traps will degrade RSNM (read static noise margin), as well as cause transition failure in SRAM operations. This is the first being observed and reported that will be considered as a major criterion in the future low voltage design of SRAM cells.
Keywords :
CMOS digital integrated circuits; MOSFET; SRAM chips; failure analysis; 2D profiling; RSNM; SRAM cells; cause transition failure; channel directions; gate oxide; lateral directions; low voltage design; multilevel RTN; multitraps; oxide depth; planar CMOS devices; read static noise margin; switching mechanisms; trigate MOSFET; vertical directions; Electron traps; Logic gates; MOS devices; MOSFET circuits; SRAM cells; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2012 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0163-1918
Print_ISBN :
978-1-4673-4872-0
Electronic_ISBN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.2012.6479072
Filename :
6479072
Link To Document :
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