DocumentCode
3546229
Title
3-D wiring across vertical sidewalls of Si photo cells for series connection and high voltage generation
Author
Kumagai, S. ; Yamamoto, T. ; Kubo, H. ; Sasaki, M.
Author_Institution
Toyota Technol. Inst., Nagoya, Japan
fYear
2012
fDate
Jan. 29 2012-Feb. 2 2012
Firstpage
60
Lastpage
63
Abstract
This paper first reports 3-D wiring across vertical sidewalls for summing the voltage of Si photo cells fabricated based on the photolithography. Si photo cells on the buried oxide are isolated each other by the buried oxide layer and the Si etching of the device layer. Wiring using the vertical sidewalls minimizes the shadow region caused by the metal electrode. The techniques of the spray coating of the photoresist and the angled exposure through the absorbent liquid are applied. 10×10 array of cells with 100-μm spans are connected in series generating 10.1V.
Keywords
elemental semiconductors; etching; photoelectric cells; photolithography; silicon; 3D wiring; buried oxide layer; etching; high voltage generation; photo cells; series connection; vertical sidewalls; Arrays; Coatings; Electrodes; Films; Resists; Silicon; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location
Paris
ISSN
1084-6999
Print_ISBN
978-1-4673-0324-8
Type
conf
DOI
10.1109/MEMSYS.2012.6170093
Filename
6170093
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